IIT Bombay’s Distinguished Alumnus, Dr. Subramanian S. Iyer, AKA Subu Iyer (B. Tech, Electrical Engineering, 1977), and Advisor to SemiX, IIT Bombay, has assumed the role of Director of the National Advanced Packaging Manufacturing Program (NAPMP) at CHIPS for America’s Research and Development (R&D) Office. Mr. Iyer brings an extensive wealth of industrial and academic experience in microelectronics and packaging to his new position.

After his stint at IIT Bombay, Dr. Iyer earned his Ph.D. in electrical engineering from UCLA. A dedicated IIT Bombay alumnus, he has been an instrumental supporter of SemiX and continues to provide invaluable guidance to the Centre, which originated from an idea conceived during a FAN meeting led by him at Ohio State University in 2022.

He will continue to maintain his distinguished professorship at UCLA and hold the Charles P. Reames Endowed Chair. He is actively engaged in exploring innovative packaging paradigms and device advancements even as his research interests encompass high-performance architectures, in-memory analogue computing, and applications in medical engineering. He also has more than 300 peer-reviewed journal publications and over 75 patents to his credit.

Previously, Dr. Iyer served at IBM, where he held various significant positions, including that of an IBM Fellow and the Director of Packaging. He is credited with pioneering developments such as the first SiGe heterojunction bipolar transistor, embedded dynamic random-access memory (eDRAM), and the initial commercial interposer and 3D memory products.

IIT Bombay extends its warmest congratulations to Dr. Subu Iyer in this next challenging phase of his professional career, even as it continues to be awed at the mammoth strides being made by its alumni community. The Institute wishes him every success in his new role, which is poised to have a profound global impact on the landscape of semiconductor science and technology, not only in the United States but also in partner nations like India.